Cerium laboratories has developed world-class expertise in providing analytical support for semiconductor manufacturers. With over 20 years of experience, we can support your manufacturing processes from fab start up, including facilities and tool qualification, to process development and yield excursion root cause analysis.
Cerium Labs can provide support for process qualifications at start up and quality control in full production facilities. Cerium’s experience in facilities start up includes qualifying bulk chemical distribution systems, sampling air quality and testing ultra pure water.
Process qualification and characterization of materials
Scanning electron microscopy (SEM) or transmission electron microscopy (TEM) can provide accurate critical dimension measurements necessary to pinpoint process parameters and verify tool performance.
Other critical processes that Cerium can monitor are:
- Implanter dose matching by dopant profile analysis using either Dynamic or Quadrupole Secondary Ion Mass Spectroscopy (SIMS).
- Airborne or surface trace contaminants by vapor phase decomposition – inductively coupled plasma mass spectrometry (VPD-ICPMS) for metals and gas chromatography-mass spectrometry (GC-MS) for the organics.
- Thin film orientation studies by x-ray diffraction (XRD).
- Thin film stoichiometry by x-ray photoelectron spectroscopy (XPS)
Yield Excursion Root Cause Analysis
Combining precision preparation by focused ion beam (FIB) with energy dispersive x-ray spectroscopy (EDS) or electron energy loss spectroscopy (EELS) we are able to understand the chemical composition and the possible source of specific site failures on finished product. Cerium has expertise in providing timely and definitive support including analytical measurements for packaging issues and regulatory compliance, analysis of incoming material, and chemical and physical characterization of returned parts.
"We have utilized Cerium Labs on many difficult TEM cross sectional analysis efforts. We have found their analytical knowledge to be excellent and their IC processing background has allowed us to communicate in an efficient manner. The clarity of the TEM images and the spectral information they have obtained using the EELS technique has been instrumental in understanding and solving some very complex processing issues. "
Tim McGrady, Failure Analysis Manager
Atmel, Colorado Springs, CO