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Analytical Imaging Techniques


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Technique

Description

Typical
Applications

Instrument

Navigation
Capability

Resolution

Minimum
Spot Size

Maximum
Sample Size

Field Emission Scanning Electron Microscopy (FE-SEM)

Scanning electron imaging to view samples at magnifications up to 500,000 times.

Metrology, construction analysis, defect analysis

Hitachi S4800, FEI XL50, Zeiss Ultra 55

Yes

6 Å

45 Å

Up to 200 mm wafer

Energy Dispersive X-Ray Spectroscopy
(EDS)

Elemental analysis

Defect analysis, construction analysis

NORAN System SIX

Yes

120 eV

1 um

Up to 200 mm wafer

Back Scattered Electron Imaging
(BSE)

Contrast imaging of wafer cross section. Provides composition information

Process identification

Zeiss Ultra 55

Yes

6 Å

45 Å

2-4 mm square sample


Focused Ion Beam
(FIB)

Sample preparation technique using ion beam to mill into very specific area of interest.

Defect analysis, construction analysis, TEM sample prep

FEI XL830, XL835 Dual Beam systems

Yes

3 nm (e-beam)

na

Up to 200 mm wafer


Dualbeam-STEM
(FIB)

Sample preparation technique using ion beam to mill into very specific area of interest. In-situ imaging using Scanning Transmission Electron Microscopy.

Defect analysis, construction analysis, TEM sample prep, Circuit edit

FEI Strata 400S

No

1 nm @ 15 kV ebeam

2 nm @ 5 kV ebeam

na

Max:80 mm diameter, 20 mm thickness

Transmission Electron Microscopy
(TEM)

Imaging of electrons transmitted through <100 nm thick speciman.

Construction analysis, crystal phase, lattice damage and grain orientation

JEM-ARM200F

JEOL 2010

Philips (FEI) CM300

Yes with FIB preparation

2 Å

10 Å

Up to 200 mm wafer using FIB preparation

Analytical Transmission Electron Microscopy
(AEM)

Elemental analysis on TEM sample.

Defect analysis, construction analysis

Gatan GIF-2002 Electron Energy Loss Spectrometer and Noran System Six EDXS

Yes with FIB preparation

2 Å

10 Å

Up to 200 mm wafer using FIB preparation

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